A cohesive zone model for fracture initiation and propagation of fused silica direct bonding interface-Reference-Cited by-同舟云学术

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A cohesive zone model for fracture initiation and propagation of fused silica direct bonding interface

Published:2019-10 Issue: Volume:219 Page:106649
ISSN:0013-7944
Container-title:Engineering Fracture Mechanics
language:en
Short-container-title:Engineering Fracture Mechanics

Author:

Maurel-Pantel A.,Voisin M.,Bui Q.,Cocheteau N.,Lebon F.,Hochard C.

Funder

Agence Nationale de la Recherche

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference34 articles.

1. Semiconductor wafer bonding: recent developments;Tong;Mater Chem Phys,1994

2. Molecular adhesion and its applications;Kendall,2004

3. Modeling the formation of spontaneous wafer direct bonding under low temperature;Tang;Microelectron Eng,2008

4. The adhesion of two elastic bodies with slightly wavy surfaces;Johnson;Int J Solids Struct,1995

5. Models of adhesive contact between rough elastic solids;Galanov;Int J Mech Sci,2011

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1. Enhancing Fusion Bonding of Fused Silica through Surface Treatments: A Comparative Study;2023 16th International Conference on Sensing Technology (ICST);2023-12-17

2. A general model of hard and soft interfaces with damage;ADVANCES IN FRACTURE AND DAMAGE MECHANICS XX;2023

3. Multi-scale Analysis of the Aging of Composite / Concrete Bonding Subjected to Monotonic and Cyclic Mechanical Loadings;Advances in Mechanical Engineering and Mechanics II;2021-11-23

4. Prediction of load-CMOD curves for HMA mixtures at intermediate temperatures subjected to mixed mode loading;Engineering Fracture Mechanics;2021-09

5. Modelling of a GFRP adhesive connection by an imperfect soft interface model with initial damage;Composite Structures;2020-05

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