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Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

  • Published:2010-05 Issue:5 Volume:46 Page:1158-1162
  • ISSN:0014-3057
  • Container-title:European Polymer Journal
  • language:en
  • Short-container-title:European Polymer Journal

Author:

Yoo Myong Jae,Kim Sang Hyun,Park Seong Dae,Lee Woo Sung,Sun Jong-Woo,Choi Jae-Hong,Nahm Sahn

Publisher

Elsevier BV

Subject

Organic Chemistry,Polymers and Plastics,General Physics and Astronomy,Materials Chemistry

Reference27 articles.

1. Influence of cure conditions on glass transition temperature and density of an epoxy resin;Cizmecioglu;J Appl Polym Sci,1986

2. The effect of stoichiometry and thermal history during cure on structure and properties of epoxy networks;Meyer;Polymer,1995

3. The effects of curing parameters on the properties development of an epoxy encapsulant material;Naito;Microelectron Reliab,2002

4. Prime RB. In: Turi EA, editor. Thermal characterization of polymeric materials. New York: Academic press; 1981.

5. Monitoring the epoxy curing by the dielectric thermal analysis method;Shigue;IEEE Trans Appl Superconduct,2004
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