1. Suhling JC, Wayne Johnson R, Mian AKM, Kaysar Rahim M, Zou Y, Ragam S, Palmer M, Ellis CD, Jaeger RC. Measurement of backside flip chip die stresses using piezoresistive test die. Proceedings of the 32nd International Symposium on Microelectronics, Chicago, Illinois, 26–28 October 1999. p. 298–303
2. Lee H, Neville K. Handbook of epoxy resins, 2nd edition. New York: McGraw-Hill Publishers; 1982. p. 7–9 [Chapter 6]
3. Koh WH, Tai BH, Kolawa EA. Low stress encapsulants for reduced failures in plastic packages. Proceedings of the International Mechanical Engineering Congress and Exposition, San Francisco, California, 12–17 November 1995
4. Glass-transition temperature-conversion relationship for an epoxy-hexahydro-4-methylphthalic anhydride system;Boey;J Appl Polym Sci,2000
5. Wu JCL, Shiue H-h, Wu S, Hung M, Lee JJ. Study of rapid cure BGA mold compound on warpage with shadow moire. Proceedings of the 49th Electronic Component and Technology Conference, San Diego, California, 1–4 June 1999. p. 708–13