Thermal conductive hybrid polyimide with ultrahigh heat resistance, excellent mechanical properties and low coefficient of thermal expansion-Reference-Cited by-同舟云学术

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Thermal conductive hybrid polyimide with ultrahigh heat resistance, excellent mechanical properties and low coefficient of thermal expansion

Published:2020-01 Issue: Volume:122 Page:109368
ISSN:0014-3057
Container-title:European Polymer Journal
language:en
Short-container-title:European Polymer Journal

Author:

Ou Xianghui,Lu Xuemin,Chen Shuangshuang,Lu Qinghua

Funder

National Natural Science and Foundation of China

Shanghai Key Projects of Basic Research

Publisher

Elsevier BV

Subject

Organic Chemistry,Polymers and Plastics,General Physics and Astronomy,Materials Chemistry

Reference60 articles.

1. LTPS TFT process on polyimide substrate for flexible AMOLED;Gao;J. Disp. Technol.,2015

2. Technology advances in flexible displays and substrates;Chen;IEEE Access,2013

3. Gao X, Development of AMOLED display from rigid to flexible;Huang;Dig. Technol. Pap. - Soc. Inf. Dispersion Int. Symp.,2016

4. Stress absorbing LTPS-TFT for highly flexible AMOLED;Chen;Dig. Technol. Pap. - Soc. Inf. Dispersion Int. Symp.,2017

5. Polymers for flexible displays: From material selection to device applications;Choi;Prog. Polym. Sci.,2008

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