FlexMEMS-enabled hetero-integration for monolithic FBAR-above-IC oscillators

Author:

Gao Chuanhai,Zhang Menglun,Jiang Yuan

Funder

National High Technology Research and Development Program

111 Project

Nanchang Institute for Microtechnology of Tianjin University

Publisher

AIP Publishing

Subject

Automotive Engineering

Reference18 articles.

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2. Small M, Ruby R, Ortiz S, Parker R, Zhang F, Shi J, Otis B. Wafer-scale packaging for FBAR-based oscillators. In: 2011 Joint Conference of the IEEE International Frequency Control and the European Frequency and Time Forum (FCS) Proceedings 2011:1–4. doi:https://doi.org/10.1109/fcs.2011.5977848.

3. Wafer-level heterointegration process of SAW devices and LSI;Park;Proceedings - IEEE Ultrasonics Symposium IEEE,2010

4. Integrating MEMS and ICs;Fischer;Microsyst Nanoeng,2015

5. ElBarkouky M, Vandersteen G, Wambacq P, Rolain Y. A 7 GHz FBAR overtone-based oscillator. In: European Microwave Week 2009, EuMW 2009: Science, Progress and Quality at Radiofrequencies, Conference Proceedings - 39th European Microwave Conference, EuMC 2009. Vol 1. ; 2009:318–321. doi:https://doi.org/10.1109/EUMC.2009.5296327.

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