Author:
Gao Chuanhai,Zhang Menglun,Jiang Yuan
Funder
National High Technology Research and Development Program
111 Project
Nanchang Institute for Microtechnology of Tianjin University
Reference18 articles.
1. Tanaka S. Heterogeneous integration by wafer-to-wafer transfer technology. In: Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE; 2014:33. doi:10.1109/LTB-3D.2014.6886172.
2. Small M, Ruby R, Ortiz S, Parker R, Zhang F, Shi J, Otis B. Wafer-scale packaging for FBAR-based oscillators. In: 2011 Joint Conference of the IEEE International Frequency Control and the European Frequency and Time Forum (FCS) Proceedings 2011:1–4. doi:https://doi.org/10.1109/fcs.2011.5977848.
3. Wafer-level heterointegration process of SAW devices and LSI;Park;Proceedings - IEEE Ultrasonics Symposium IEEE,2010
4. Integrating MEMS and ICs;Fischer;Microsyst Nanoeng,2015
5. ElBarkouky M, Vandersteen G, Wambacq P, Rolain Y. A 7 GHz FBAR overtone-based oscillator. In: European Microwave Week 2009, EuMW 2009: Science, Progress and Quality at Radiofrequencies, Conference Proceedings - 39th European Microwave Conference, EuMC 2009. Vol 1. ; 2009:318–321. doi:https://doi.org/10.1109/EUMC.2009.5296327.
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