Formation of subsurface cracks in silicon wafers by grinding
Author:
Affiliation:
1. Key Laboratory for Precision and Non-Traditional Machining of Ministry of Education, Dalian University of Technology, Dalian 116024, China
2. College of Engineering, Southern University of Science and Technology, Shenzhen 518055, China
Funder
National Natural Science Foundation of China
Science Fund for Creative Research Groups
Publisher
AIP Publishing
Subject
Automotive Engineering
Reference41 articles.
1. Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining
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