Interface thermal conductance in silicene and stanene monolayer:A molecular dynamics study-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Interface thermal conductance in silicene and stanene monolayer:A molecular dynamics study

Published:2019-06 Issue: Volume:130 Page:258-266
ISSN:0749-6036
Container-title:Superlattices and Microstructures
language:en
Short-container-title:Superlattices and Microstructures

Author:

Wu Jiaxin,Wen Hao,Shi Hongzhen,Chen Changpeng,Huang Bin,Wei Yufan,Li Min

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference57 articles.

1. The structure of suspended graphene sheets

2. Room-Temperature Quantum Hall Effect in Graphene

3. Electric Field Effect in Atomically Thin Carbon Films

4. 100-GHz Transistors from Wafer-Scale Epitaxial Graphene

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Phonon transport in vacancy induced defective stanene/hBN van der Waals heterostructure;Nanotechnology;2024-08-05

2. Molecular dynamics simulation of thermal transport properties of phonons at interface of Au-TiO<sub>2</sub> photoelectrode;Acta Physica Sinica;2024

3. High-Throughput Computations of Cross-Plane Thermal Conductivity in Multilayer Stanene;International Journal of Heat and Mass Transfer;2021-06

4. Phonon thermal conductivity of the stanene/hBN van der Waals heterostructure;Physical Chemistry Chemical Physics;2021

5. Competing effects of strain and vacancy defect on thermal conductivity of silicene: A computational study;Computational Materials Science;2020-02

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3