Study of gluing and wire bonding for the Belle II Silicon Vertex Detector-Reference-Cited by-同舟云学术

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Study of gluing and wire bonding for the Belle II Silicon Vertex Detector

Published:2014-11 Issue: Volume:763 Page:255-259
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

Kang K.H.,Hara K.,Higuchi T.,Hyun H.J.,Jeon H.B.,Joo C.W.,Kah D.H.,Kim H.J.,Mibe T.,Onuki Y.,Park H.,Rao K.K.,Sato N.,Shimizu N.,Tanida K.,Tsuboyama T.,Uozumi S.

Funder

Basic Science Research Program

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference11 articles.

1. Z. Doležal, S. Uno (Eds.), Belle II Technical Design Report, KEK Report 2010-1, 2010.

2. S. Hashimoto, M. Hazumi (Eds.), Letter of Intent for KEK Super B Factory, KEK Report 2004-4, 2004.

3. The Belle II Silicon Vertex Detector

4. The Belle-II DEPFET pixel detector: A step forward in vertexing in the superKEKB flavour factory

5. Design and results from the APV25, a deep sub-micron CMOS front-end chip for the CMS tracker

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A bonding study toward the quality assurance of Belle-II silicon vertex detector modules;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2016-09

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