Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications-Reference-Cited by-同舟云学术

Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications

Published:2011-09 Issue:1 Volume:650 Page:189-193
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

Fritzsch T.,Jordan R.,Oppermann H.,Ehrmann O.,Töpper M.,Baumgartner T.,Lang K.-D.

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference10 articles.

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2. J. Moss et al., Commissioning and operation of the ATLAS pixel detector, Nucl. Instr. and Meth. A, this issue.

3. D.S. Patterson et al., Wafer bumping technologies—a comparative analysis of solder deposition processes and assembly consideration, in: Proceedings of InterPack, EEP-vol. 19-1, Advances in Electronic Packaging, 1997, pp. 337–351.

4. R. Labie et al., Reliability testing of Cu–Sn intermetallic micro-bump interconnections for 3D-device stacking, in: Proceedings of ESTC 2010, Berlin, Germany, September 2010.

5. Flip chip bumping technology—Status and update

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