Radiation hard active pixel sensor with 25μm × 50μm pixel size designed for capacitive readout with RD53 ASIC
Author:
Funder
EU
Publisher
Elsevier BV
Subject
Instrumentation,Nuclear and High Energy Physics
Reference8 articles.
1. Hybrid pixel particle-detector without bump interconnection;Peric;IEEE Trans. Nucl. Sci.,2009
2. Test beam measurement of ams H35 HV-CMOS capacitively coupled pixel sensor prototypes with high-resistivity substrate;Benoit;J. Instrum.,2018
3. Testbeam results of irradiated ams H18 HV-CMOS pixel sensor prototypes;Benoit;J. Instrum.,2018
4. Design and standalone characterisation of a capacitively coupled HV-CMOS sensor chip for the CLIC vertex detector;Kremastiotis;J. Instrum.,2017
5. The RD53A integrated circuit,2018
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1. A high time resolution and high dynamic range ASIC for the micro-vertex detector in the PANDA experiment;Journal of Instrumentation;2024-02-01
2. Monolithic pixel sensor with 25 µm × 35 µm pixel size and high time resolution implemented in 180 nm technology;Journal of Instrumentation;2022-07-01
3. Measurement results on capacitively coupled particle detector with PHOTON readout chip;Journal of Instrumentation;2020-09-30
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