1. M. Miyata, Sn–Ag solder bump using 2-step plating process, in: Proceedings of the Fourth 2000 IEMT/IMC Symposium, 2000, pp. 122–127.
2. Z. S. Karim, R. Schetty, Lead-free bump interconnections for Flipchip applications, in: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2000, pp. 274–278.
3. P. Wölflick, K. Feldmann, Lead-free low-cost Flipchip process chain: layout, process, reliability, in: Proceedings of the IEEE International Electronics Manufacturing Technology (IEMT) Symposium, 2002, pp. 27–34.
4. M. McCormack, S. Jin, The design and properties of new, Pb-free solder alloys, in: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1994, pp. 7–14.
5. Development and validation of a lead-free alloy for solder paste applications