Influence of electropolished copper substrate on morphology of electroplating self-supporting Ni films-Reference-Cited by-同舟云学术

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Influence of electropolished copper substrate on morphology of electroplating self-supporting Ni films

Published:2019-05 Issue: Volume:927 Page:343-348
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

Wang Xiaoyu,Han Yuncheng,Zhang Jiachen,Li Ziwei,Li Taosheng,Zhao Xueyan,Liu Weiping

Funder

National Natural Science Foundation of China

Anhui provincial Natural Science Foundation, China

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference26 articles.

1. The production of thin self-supporting nickel foils using an electroplating method;Arnison;Nucl. Instrum. Methods,1976

2. Influence of substrates on roughness of self-supporting Ni films;Gao;Nucl. Inst. Methods Phys. Res. A,2007

3. Team FDS, Design analysis of the China dual-functional lithium lead (DFLL) test blanket module in ITER;Wu;Fusion Eng. Des.,2007

4. Development strategy and conceptual design of China lead-based research reactor;Wu;Ann. Nucl. Energy,2016

5. Development of high intensity D–T fusion neutron generator HINEG;Wu;Int. J. Energy Res.,2018

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