Alternative monomer for BisGMA-free resin composites formulations
Author:
Funder
National Institute of Dental and Craniofacial Research
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Dentistry,General Materials Science
Reference27 articles.
1. Effects of composition and reactivity on the reaction kinetics of dimethacrylate/dimethacrylate copolymerizations;Lovell;Macromolecules,1999
2. Influence of UEDMA, BisGMA and TEGDMA on selected mechanical properties of experimental resin composites;Asmussen;Dent Mater,1998
3. Presence and leaching of bisphenol a (BPA) from dental materials;Becher;Acta Biomater Odontol Scand,2018
4. Bisphenol A and other compounds in human saliva and urine associated with the placement of composite restorations;Kingman;J Am Dent Assoc,2012
5. A systematic review of exposure to bisphenol A from dental treatment;Marzouk;JDR Clin Transl Res,2019
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