Author:
Jabari Elahe,Tong Steven,Azhari Amir,Toyserkani Ehsan
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. Jones RE, Chatterjee R, Pozder S. Technology and application of 3D interconnect. In: Proceedings of IEEE international conference on integrated circuit design and technology; 2007. p. 1–4.
2. Thomasius R, Grundmann S, Niedermayer M, Achterholt R, Guttowski S, John W, et al. Miniaturized wireless sensors for automotive applications. In: Proceedings of the advanced mircosystems for automotive applications conference; 2006. p. 353–67.
3. Swinnen B, Beyne E. Introduction to IMEC's research on 3D-technology. In: Proceedings of IMEC conference; 2007. p. 125–30.
4. O’Reilly M, Leal J. Jetting your way to fine-pitch 3D interconnects. Chip Scale Review; 2010.
5. Microprocessor system applications and challenges for through-silicon-via-based three-dimensional integration, IET Comput;Karnik;Digital Technol.,2009
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