Non-planar interconnects in double-sided flexible Cu-PET substrates using a laser-assisted maskless microdeposition process: 3D finite element modeling and experimental analysis

Author:

Jabari Elahe,Tong Steven,Azhari Amir,Toyserkani Ehsan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Jones RE, Chatterjee R, Pozder S. Technology and application of 3D interconnect. In: Proceedings of IEEE international conference on integrated circuit design and technology; 2007. p. 1–4.

2. Thomasius R, Grundmann S, Niedermayer M, Achterholt R, Guttowski S, John W, et al. Miniaturized wireless sensors for automotive applications. In: Proceedings of the advanced mircosystems for automotive applications conference; 2006. p. 353–67.

3. Swinnen B, Beyne E. Introduction to IMEC's research on 3D-technology. In: Proceedings of IMEC conference; 2007. p. 125–30.

4. O’Reilly M, Leal J. Jetting your way to fine-pitch 3D interconnects. Chip Scale Review; 2010.

5. Microprocessor system applications and challenges for through-silicon-via-based three-dimensional integration, IET Comput;Karnik;Digital Technol.,2009

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