Far-field modeling of Moiré interferometry using scalar diffraction theory-Reference-Cited by-同舟云学术

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Far-field modeling of Moiré interferometry using scalar diffraction theory

Published:2012-08 Issue:8 Volume:50 Page:1168-1176
ISSN:0143-8166
Container-title:Optics and Lasers in Engineering
language:en
Short-container-title:Optics and Lasers in Engineering

Author:

Chen Bicheng,Basaran Cemal

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference47 articles.

1. High sensitivity Moiré: experimental analysis for mechanics and materials;Post,1994

2. Thermal deformation analysis of various electronic packaging products by Moir[e-acute] and microscopic Moir[e-acute] Interferometry;Han;Journal of Electronic Packaging,1995

3. Application of Moire´ interferometry to determine strain fields and debonding of solder joints in BGA packages;Heng;Components and Packaging Technologies, IEEE Transactions on,2004

4. Measurement of high electrical current density effects in solder joints;Ye;Microelectronics Reliability,2003

5. Thermomechanical behavior of micron scale solder joints under dynamic loads;Zhao;Mechanics of Materials,2000

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