Outgassing of Water Molecules During Silicon Fusion Bonding
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference9 articles.
1. Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS;Najafi;Proc. SPIE MOEMS/MEMS,2003
2. Wafer level packaging of MEMS;Esashi;J. Micromech. Microeng.,2008
3. A Low-Temperature Thin-Film Electroplated Metal Vacuum Package;Stark;J. Microelectromechanical Systems,2004
4. A process for SOI resonators with surface micromachined covers and reduced electrostatic gaps;Dekker;J. Micromech. Microeng.,2010
5. Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems;Tao;Microelectronics Reliability,2004
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1. Effect of Environment on Activation and Sorption of Getter Alloys and Multilayers for Hybrid Wafer-level Vacuum Packaging;Sensors and Materials;2019-09-20
2. Molecular simulation of water vapor outgassing from silica nanopores;Microfluidics and Nanofluidics;2015-05-05
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