Design and investigation on the reliability of a ceramic power package-Reference-Cited by-同舟云学术

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Design and investigation on the reliability of a ceramic power package

Published:2022 Issue: Volume:2 Page:100029
ISSN:2772-6711
Container-title:e-Prime - Advances in Electrical Engineering, Electronics and Energy
language:en
Short-container-title:e-Prime - Advances in Electrical Engineering, Electronics and Energy

Author:

Tang Lifeng,Cao Kun

Publisher

Elsevier BV

Reference19 articles.

1. Miniaturized and high-performance RF packages with ultra-thin glass substrates;SukKim;Microelectronics J.,2018

2. Crosstalk reduction between RF input channels of coherent-driver-modulator package by introducing enhanced ground lead structure;Ozaki;Electron. Lett.,2020

3. Thermal optimization of GaN-on-Si HEMTs with plastic package;Liu;Microelectron. Reliab.,2011

4. High-power transistors fit standard plastic packages;Browne;Microwaves RF,2018

5. A plastic package GaAs MESFET 5.8GHz receiver front-end with on-chip matching for ETC system;Low;IEEE Trans. Microw. Theory Tech.,2000

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1. Enhancing Board-Level Drop Impact Reliability Through Epoxy-Based Underfill Modification;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

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