Crosstalk reduction between RF input channels of coherent‐driver‐modulator package by introducing enhanced ground lead structure

Author:

Ozaki J.1ORCID,Tanobe H.1,Ishikawa M.1

Affiliation:

1. NTT Device Innovation Center, NTT Corporation3‐1, Morinosato WakamiyaAtsugi‐shiKanagawa Pref.243Japan

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Reference5 articles.

1. OIF: ‘Implementation agreement for the high bandwidth coherent driver modulator (HB‐CDM)’. Available athttps://www.oiforum.com/wp‐content/uploads/2019/01/OIF‐HB‐CDM‐01.0.pdf

2. Ultra-Low Power Dissipation (<2.4 W) Coherent InP Modulator Module with CMOS Driver IC

3. Up to 80 Gbaud DP‐16QAM operation using InP‐based high‐bandwidth coherent driver modulator

4. OIF: ‘Implementation agreement for micro intradyne coherent receivers’. Available athttps://www.oiforum.com/wp‐content/uploads/2019/01/OIF‐DPC‐MRX‐02.0.pdf

5. InP‐based monolithically integrated photonic devices for digital coherent transmission;Yagi H.;IEEE J. Sel. Top. Quantum Electron.,2018

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