Applications of passive integration-Reference-Cited by-同舟云学术

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Applications of passive integration

Published:1998-01 Issue:3 Volume:51 Page:411-428
ISSN:0165-5817
Container-title:Philips Journal of Research
language:en
Short-container-title:Philips Journal of Research

Author:

Pulsford N.J.

Publisher

Elsevier BV

Subject

General Engineering

Reference9 articles.

1. Passive Components in Electronic Applications: Requirements and Prospects for Integration;Frye;J.Microcircuits and Electronic Packaging,1996

2. Chip Scale Packaging Blooms;Levine;Electronic News,1996

3. The Case for Multichip Modules, Semiconductor International;Doane,1994

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Dielectric properties of Ta2O5 thin films deposited onto Ti and TiO2 layer;Metals and Materials International;2002-11

2. Sol-gel, modified sol-gel, and metallo-organic decomposition techniques for complex oxide films;Handbook of Advanced Electronic and Photonic Materials and Devices;2001

3. Oxide Films for Integrated Capacitors in Thin Film Functional Modules;MRS Proceedings;2000

4. Beratender Ausschuß Der Industriephysiker: Dünnschichtsysteme für passive Bauelemente;Physik Journal;1999-01

5. Thin Film Decoupling Circuits, Making Use of a Three-dimensional Integration of Thin Film Passive Components;MRS Proceedings;1999

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