Author:
Klee M.,Löbl P.,Kiewitt R.,Brand W.,van Oppen P.,Lok P.
Abstract
AbstractIn electronic circuits besides active devices a major part of the components are discrete passive components such as capacitors, resistors and inductors. Especially in the telecommunication circuits, miniaturisation is a major issue. To achieve a high degree of miniaturisation of passive components, thin film processes have been applied. A thin film module for high frequency applications has been demonstrated with a three-dimensional integration of a thin film resistor, a thin film X7R capacitor and a thin film NP0 capacitor processed on top of each other.
Publisher
Springer Science and Business Media LLC
Reference13 articles.
1. Materials specification for MCM-D decoupling capacitors using PZ, PZT, PLZT and BST dielectrics
2. 11. Schwartz R. W. , Dimos D. , Lockwood S. J. , Torres V. M. , Mat. Res. Soc. Symp. Proc., “Ferroelectric Thin Films Ill’ edited by Tuttle B. A. , Myers E. R. , Desu S. B. , Larsen P. K. , 310, 59–64(1993)
3. Technology for passive integration
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献