Molecular Dynamic Dimulation of Energy and Structural Stability on Twist Grain Boundary in Bicrystal Copper-Reference-Cited by-同舟云学术

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Molecular Dynamic Dimulation of Energy and Structural Stability on Twist Grain Boundary in Bicrystal Copper

Published:2012 Issue: Volume:27 Page:1730-1737
ISSN:1877-7058
Container-title:Procedia Engineering
language:en
Short-container-title:Procedia Engineering

Author:

Liu Yuan,Yang Sen

Publisher

Elsevier BV

Subject

Applied Mathematics

Reference29 articles.

2. Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials

3. Optimization of grain boundary character distribution for intergranular corrosion resistant 304 stainless steel by twin-induced grain boundary engineering

4. Suppression of chromium depletion by grain boundary structural change during twin-induced grain boundary engineering of 304 stainless steel

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Molecular dynamics study on tensile strength of twist grain boundary structures under uniaxial tension in copper;Vacuum;2021-02

2. Atomic simulations of twist grain boundary structures and deformation behaviors in aluminum;AIP Advances;2017-01

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