Molecular dynamics study on tensile strength of twist grain boundary structures under uniaxial tension in copper-Reference-Cited by-同舟云学术

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Molecular dynamics study on tensile strength of twist grain boundary structures under uniaxial tension in copper

Published:2021-02 Issue: Volume:184 Page:109874
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Cui Can,Yu Qiang,Wang Wei,Xu Weiwei,Chen Lijie^ORCID

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference73 articles.

1. Strength asymmetry in nanocrystalline metals under multiaxial loading;Lund;Acta Mater.,2005

2. Role of grain boundary on the sources of size effects;Voyiadjis;Comput. Mater. Sci.,2016

3. A cooperative nano-grain rotation and grain-boundary migration mechanism for enhanced dislocation emission and tensile ductility in nanocrystalline materials;Liu;Mater. Sci. Eng.,2019

4. Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film;Hu;Vacuum,2019

5. Crack nucleation during mechanical fatigue in thin metal films on flexible substrates;Kim;Acta Mater.,2013

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