Determining The Acoustic Resistance of Small Sound Holes for MEMS Microphones
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics
Reference3 articles.
1. Feiertag G, Winter M, Leidl A. Flip chip packaging for MEMS microphones. Microsystem Technologies 2010; 16/5:817-23.
2. Winter M, Feiertag G, Leidl A, Seidel H. Chip scale package of a MEMS microphone and ASIC stack. Proc IEEE int Conference on Micro-Electro-Mechanical Systems, Hong Kong; Jan 2010.
3. Winter M, Feiertag G, Leidl A, Seidel H. Influence of a chip scale package on the frequency response of a MEMS microphone. Microsystem Technologies 2010; 16/5:809-15.
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