Vibration Response Prediction of the Printed Circuit Boards Using Experimentally Validated Finite Element Model-Reference-Cited by-同舟云学术

Vibration Response Prediction of the Printed Circuit Boards Using Experimentally Validated Finite Element Model

Published:2016 Issue: Volume:144 Page:576-583
ISSN:1877-7058
Container-title:Procedia Engineering
language:en
Short-container-title:Procedia Engineering

Author:

Somashekar V.N.,Harikrishnan S.,Aejaz Ahmed P.S.M.,Kamesh D.

Publisher

Elsevier BV

Subject

Applied Mathematics

Reference5 articles.

1. Steinberg, D.S. Vibration Analysis for Electronic Equipment. 3rd ed. New York: John Wiley & Sons Inc.; 2000.

2. Sensitivity analysis of simplified Printed Circuit Board finite element models;Amy;Microelectronics Reliability,2009

3. Dynamic responses and solder joint reliability under board level drop test;Jing-en Luan;Microelectronics Reliability,2007

4. Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards;Yuqi Wang;Microelectronics Reliability,2006

5. Jayaraman S, Manish Trikha, Somashekar V N, Kamesh D. Vibration Analysis of Printed Circuit Boards. Interbational Journal of Applied Engineering Research, ISSN 0973-4562 Vol.10 No. 24 (2015).

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