1. http://www.boulder.nist.gov/div853/lead_free/part1.html#%201.
2. Steinberg, D.S., “Vibration Analysis for Electronic Equipment,” John Wiley & Sons, New York, 1998.
3. Zhou, Y., M. Al-Bassyiouni, A. Dasgupta, “Harmonic and Random Vibration Durability of SAC305 and Sn37pb Solder Alloys,” IEEE Trans Components & Packaging Tech, Vol. 33, No. 2, 2010, pp. 319-328, Digital Object Identifier 10.1109/TCAPT. 2009.2036834.
4. Zhou, Y. and Dasgupta, A., “Vibration Durability Assessment of Sn3.0Ag0.5Cu & Sn37Pb Solders under Harmonic Excitation”, Published at ASME International Mechanical Engineering Congress and Exposition, Seattle, WA, Nov, 2007, Paper num 43493.
5. Upadhyayula, K., and Dasgupta, A., “Accelerated Stress Testing of Surface-Mount Interconnects under Combined Temperature and Vibration Loading,” Chapter 12, Pg 189, Accelerated Stress Testing Handbook for Quality Products in a Global Market, Eds.: H. A. Chan & P. J. Englert, Pub. IEEE Press (USA) and Wiley Blackwell (UK), 2001.