Study on the joining of ceramic matrix composites to an Al alloy for advanced brake systems
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Full-ceramic brake systems for high performance friction application;Langhof;J. Eur. Ceram. Soc.,2016
2. Research and prospect of ceramics for automotive disc-brakes;Wanyang;Ceram. Int.,2021
3. Integration of CMC brake disks in automotive brake systems;Renz;J. Appl. Ceram. Technol.,2012
4. Preparation and mechanical properties of CCF reinforced RBSC braking composite from pre-liquid dispersion;Alei;Ceram. Int.,2019
5. Microstructure and frictional properties of C/SiC brake materials with sandwich structure;Shangwu;Ceram. Int.,2011
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Microstructure and properties of YIG/YIG magnetic homogenization joint fabricated by a novel Bi2O3–B2O3–NiO–Fe2O3 magnetic glass;Ceramics International;2024-08
2. Thermal Conductivity of AlSi12/Al2O3-Graded Composites Consolidated by Hot Pressing and Spark Plasma Sintering: Experimental Evaluation and Numerical Modeling;Metallurgical and Materials Transactions A;2024-07-18
3. Microstructure and properties of C/C and C/SiC composites brazed by reactive infiltration of Si Zr filler alloy;Materials Characterization;2024-07
4. Application of Ag-Cu-Ti active metal composite filler in ceramic joining: a review;Frontiers of Materials Science;2023-10-16
5. Influence of Design Parameters on Mechanical Behavior of Multi-Bolt, Countersunk C/SiC Composite Joint Structure;Materials;2023-09-22
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3