Influence of Design Parameters on Mechanical Behavior of Multi-Bolt, Countersunk C/SiC Composite Joint Structure

Author:

Wang Hongcui1ORCID,Guo Lijia1,Li Weijie1,Zhang Mengshan2,Hong Yiqiang3,Yang Wei3,Zhang Zhongwei4

Affiliation:

1. School of Civil Engineering, Beijing Jiaotong University, Beijing 100044, China

2. Beijing Mechanical Equipment Institute, Beijing 100039, China

3. Beijing System Design Institute of Electro-Mechanic Engineering, Beijing 100854, China

4. Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China

Abstract

Aerospace vehicle connection constructions are in urgent need of joint structures with excellent aerodynamic profiles and environmental adaptability. To address issues such as poor aerodynamic profile, material thermal expansion coefficient mismatch, and limited joint structure evaluation indexes, a multi-bolt, countersunk C/SiC composite joint structure is presented in this study. The development of a 3D Hashin progressive damage model and its dedicated solver code is presented. The validity of the model is confirmed by comparing simulation results with experimental data. Three evaluation indexes are proposed, peak load, weight increment efficiency, and bolt load distribution, to thoroughly evaluate the mechanical performance of multi-bolt, countersunk C/SiC composite joint structures. Using the proposed model and evaluation indices, we evaluate sixteen different designs of multi-bolt, countersunk C/SiC composite joint structures and analyze how design parameters affect their mechanical properties and damage patterns. The results show that the best mechanical properties of the joint structure are achieved when the ratio of bolt pitch to through hole diameter is 3, the ratio of bolt spacing between columns to through hole diameter is 4, the ratio of the distance between the free edge of the substrate to through hole diameter is 1.5, the ratio of through hole diameter to specimen thickness is 1.7, and the ratio of the distance between the edge of the substrate to through hole diameter is 1.5.

Funder

National Key R&D Program of China

Young Elite Scientists Sponsorship Program by CAST

Publisher

MDPI AG

Subject

General Materials Science

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