1. Flaw generation during constrained sintering of metal-ceramic and metal–glass multilayer films;Cheng;J. Am. Ceram. Soc.,1989
2. Constrained-film sintering of a gold circuit paste;Choe;J. Marer. Res.,1995
3. Constrained sintering of silver circuit paste;Lin;J. Am. Ceram. Soc.,2008
4. Quasi-elliptic and Chebyshev compact LTCC multi-pole filters functioning in the submillimetric wave region at 150 GHz;Khalil;IEEE Trans. Microw. Theory Tech.,2010
5. European Microelectronics and Packaging Conference, International Microelectronics and Packaging Society, Deutschland, European Microelectronics and Packaging Conference, European Microelectronics and Packaging Conference & Exhibition, EMPC, 2015 European Microelectronics Packaging Conference (EMPC) date: 14-16 Sept. 2015, IEEE, Piscataway, NJ. 2015. 〈http://ieeexplore.ieee.org/servlet/opac?Punumber=7369474〉. (Accessed 16 March 2018).