Funder
National Natural Science Foundation of China
Natural Science Foundation of Hunan Province of China
Research Project of National University of Defense Technology
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. Y. Li, D. Goyal, 3D microelectronic packaging: from fundamentals to applications (Springer, Berlin, 2017)
2. H. Young Jun, D.S. Jung, H.Y. Koo, J.H. Kim, Y.N. Ko, K. Yun Chan, Characteristics of ZnO–B2O3–SiO2–CaO glass frits prepared by spray pyrolysis as inorganic binder for Cu electrode. J. Alloys Compd. 509, 8077–8081 (2011)
3. J. Raynaud, V. Pateloup, M. Bernard, D. Gourdonnaud, D. Passerieux, D. Cros, T. Chartier, Hybridization of additive manufacturing processes to build ceramic/metal parts: example of LTCC. J. Eur. Ceram. Soc. 40, 759–767 (2020)
4. M. Jianli, F. Zhifen, L. Peng, W. Bing, L. Yang, Microwave dielectric properties of low-fired Li2TiO3–MgO ceramics for LTCC applications. Mater. Sci. Eng. B 204, 15–19 (2016)
5. X. Yao, H. Jiao, L. Yuanming, L. Shihong, Y. Shuang Wu, Y. Xu, Z. Ming, Z. Limin, H. Zihan, Glass structure, phase transformation and microwave dielectric properties of CaO–B2O3–SiO2 glass-ceramics with addition of La2O3. J. Mater. Sci.: Mater. Electron. 28, 9911–9918 (2017)
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