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Modified gel casting technique to fabricate honeycomb structured vitrified-bonded ultrafine diamond grinding wheels

  • Published:2020-03 Issue:4 Volume:46 Page:4462-4469
  • ISSN:0272-8842
  • Container-title:Ceramics International
  • language:en
  • Short-container-title:Ceramics International

Author:

Miao Weipeng,Ding Yulong,Zhao Yanjun,Bao Hua,Yan Ning,Yang Wei,Hui Zhen,Liu Bin

Funder

Zheng Luo New National Innovation-oriented Industrial Cluster Project

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference32 articles.

1. Shaped silicon-crystal wafers obtained by plastic deformation and their application to silicon-crystal lenses;Nakajima;Nat. Mater.,2005

2. A grinding-based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers;Zhang;Int. J. Mach. Tool Manuf.,2006

3. A new kinematics for ultra precision grinding of conical surfaces using a rotary table and a cup wheel;Huo;Int. J. Mach. Tool Manuf.,2012

4. Ultraprecision grinding of silicon wafers using a newly developed diamond wheel;Zhou;Mater. Sci. Semicond. Process.,2017

5. Preparation of silica-coated ultrafine diamond and dispersion in ceramic matrix;Zhao;Mater. Lett.,2013

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