A grinding-based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers-Reference-Cited by-同舟云学术

A grinding-based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers

Published:2006-03 Issue:3-4 Volume:46 Page:397-403
ISSN:0890-6955
Container-title:International Journal of Machine Tools and Manufacture
language:en
Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Zhang X.H.,Pei Z.J.,Fisher Graham R.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference14 articles.

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3. Online Staff, Silicon shipments, revenues rise, Electronic News, 2/9/2005, 2005, available: http://www.reed-electronics.com/electronicnews/article/CA502571.

4. Online Staff, Global semi sales hit record high, Electronic News, 1/31/2005, 2005, available: http://www.reed-electronics.com/electronicnews/article/CA500270.

5. M. Kulkarni, A. Desai, Silicon wafering process flow, US Patent 6,294,469, 2001.

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