3D grinding mark simulation and its applications for silicon wafer grinding
Author:
Funder
Ministry of Science and Technology, Taiwan
Ministry of Education
GlobalWafers Co.
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s00170-023-12931-8.pdf
Reference26 articles.
1. Chen B, Luo L, Jiao H, Li S, Li S, Deng Z, Yao H (2021) Affecting factors, optimization, and suppression of grinding marks: a review. Int J Adv Manuf Technol 115(1–2):1–29. https://doi.org/10.1007/s00170-021-07116-0
2. Li ZC, Pei ZJ, Fisher GR (2006) Simultaneous double side grinding of silicon wafers: a literature review. Int J Mach Tools Manuf 46(12–13):1449–1458. https://doi.org/10.1016/j.ijmachtools.2005.09.011
3. Liu JH, Pei ZJ, Fisher GR (2007) Grinding wheels for manufacturing of silicon wafers: a literature review. Int J Mach Tools Manuf 47(1):1–13. https://doi.org/10.1016/j.ijmachtools.2006.02.003
4. Shiha AJ, Lee NL (1999) Precision cylindrical face grinding. Precis Eng 23(3):177–184. https://doi.org/10.1016/S0141-6359(99)00008-2
5. Chen Z, Wei X, Ren Q, Xie X (2009) Analysis and simulation of grinding motion on large size wafer self-rotating grinding. Diam Abrasives Eng 5:1–12. https://doi.org/10.3969/j.issn.1006-852X.2009.05.001
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