Development of the embedded capacitor with ceramic/resin hybrid films for LNA module-Reference-Cited by-同舟云学术

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Development of the embedded capacitor with ceramic/resin hybrid films for LNA module

Published:2014-08 Issue:7 Volume:40 Page:10177-10182
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Lim Jongwoo,Park Seong-Dae,Yoo Chan-Sei,Kim Jihoon,Yoon Ho-Gyu,Kim Jonghee^ORCID

Funder

Core Material Development Program, Ministry of Knowledge Economy, Republic of Korea

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Inkjet printed system-in-package design and manufacturing;Miettinen;Microelectron. J.,2008

2. Multilayered Low Temperature Co-fired Ceramics (LTCC) Technology;Imanaka,2003

3. Novel polymer–ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application;Rao;J. Appl. Polym. Sci.,2002

4. Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates;Bhattacharya;J. Mater. Sci. Mater. Electron.,2000

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1. Alumina‐Epoxy‐Pore Composites Fabricated by Inkjet Printing for Wireless Communication Technology;Advanced Materials Interfaces;2023-12-28

2. Cost-effective fabrication of customized LTCC devices with multilayer using multi-material 3D printing;Journal of Manufacturing Processes;2023-12

3. All inkjet-printed flexible wireless power transfer module: PI/Ag hybrid spiral coil built into 3D NiZn-ferrite trench structure with a resonance capacitor;Nano Energy;2019-08

4. All-inkjet-printed flexible piezoelectric generator made of solvent evaporation assisted BaTiO3 hybrid material;Nano Energy;2017-11

5. Fabrication of barium titanate nanoparticles/poly (methylmethacrylate) composite films by a combination of deposition process and spin-coating technique;Journal of Materials Research and Technology;2014-10

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