Chapter 8 Rutherford Backscattering Studies of Ion Implanted Semiconductors

Author:

Nipoti Roberta,Servidori Marco

Publisher

Elsevier

Reference37 articles.

1. “Ion Implantation Effects of Nitrogen, Boron, and Aluminum in Hexagonal Silicon Carbide,”;Addamiano;J. Electrochem. Soc.,1972

2. “Different Methods for the Determination of Damage Profiles in Si from RBS-Channeling Spectra: A Comparison,”;Albertazzi;Nucl. Instrum. Meth.,1996

3. “Comparative Analysis of Extended Defect Depth Profiles in Silicon by Rutherford Backscattering, X-Ray and Electron Microscopy,”;Bentini;Nucl. Instrum. Meth.,1987

4. “RBS-Channeling Spectra: Simulation of As-Implanted Si Samples Through an Empirical Formula for <100> Axial Dechanneling of He in Silicon,”;Bianconi;Nucl. Instrum. Meth.,1994

5. “Recrystallization of Ion-Implanted α-SiC,”;Bohn;J. Material Res.,1987

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2. Ion-beam induced damage and annealing behaviour in SiC;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1998-05

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