The effects of complex agent and sintering temperature on conductive copper complex paste-Reference-Cited by-同舟云学术

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The effects of complex agent and sintering temperature on conductive copper complex paste

Published:2022-12 Issue:12 Volume:8 Page:e12624
ISSN:2405-8440
Container-title:Heliyon
language:en
Short-container-title:Heliyon

Author:

Naderi-Samani Hamed^ORCID,Razavi Reza Shoja,Mozaffarinia Reza

Publisher

Elsevier BV

Subject

Multidisciplinary

Reference22 articles.

1. Printable conductive inks used for the fabrication of electronics: an overview;Dimitriou;Nanotechnology,2021

2. MODs vs. NPs: vying for the future of printed electronics;Douglas;Chem.--Eur. J.,2021

3. 3D printed electronics: processes, materials and future trends;Tan;Prog. Mater. Sci.,2022

4. Reactive sintering of Cu nanoparticles at ambient conditions for printed electronics;Dai;ACS Omega,2020

5. Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: microstructure, resistivity, oxidation resistance, and long-term stability;Li;J. Alloys Compd.,2018

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles;Journal of Materials Science: Materials in Electronics;2024-04

2. Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging;Journal of Electronic Materials;2024-03-29

3. Multi-functional phase for precision sampling resistors for HVDC voltage transformer and efficient microwave absorption;Materials Research Bulletin;2024-03

4. Synthesis of silver nanoparticles for use in conductive inks by chemical reduction method;Heliyon;2023-10

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