Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability-Reference-Cited by-同舟云学术

Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability

Published:2018-01 Issue: Volume:732 Page:240-247
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Li Wanli^ORCID,Li Lingying,Gao Yue,Hu Dawei,Li Cai-Fu,Zhang Hao,Jiu Jinting,Nagao Shijo,Suganuma Katsuaki

Funder

China Scholarship Council

JST Advanced Low Carbon Technology Research and Development Program (ALCA) project “Development of a high frequency GaN power module package technology”

International Research Promotion Program (IRPR) of Osaka University

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference45 articles.

1. Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials;Perelaer;J. Mater. Chem.,2010

2. Room temperature synthesis of a copper ink for the intense pulsed light sintering of conductive copper films;Dharmadasa;ACS Appl. Mater. Interfaces,2013

3. Conductive nanomaterials for printed electronics;Kamyshny;Small,2014

4. Controllable synthesis and sintering of silver nanoparticles for inkjet-printed flexible electronics;Zhang;J. Alloy. Compd,2015

5. Sintering of inkjet printed copper nanoparticles for flexible electronics;Jang;Scr. Mater.,2010

Cited by 47 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recent advances in protective technologies against copper corrosion;Journal of Materials Science & Technology;2024-12

2. A Comparative Study of Single and Dual Sintering Processes of Metal Nanoparticles for Flexible Electronics Application;Advanced Engineering Materials;2024-05-21

3. Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics;ACS Applied Electronic Materials;2024-05-14

4. Preparation of graphene-coated Cu particles with oxidation resistance by flash joule heating;Carbon;2024-04

5. Insight into the Types of Alkanolamines on the Properties of Copper(II) Formate-Based Conductive Ink;Langmuir;2024-03-21