Ceramic/metal interfacial crack growth: Toughening by controlled microcracks and interfacial geometries
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference45 articles.
1. The Thin-Film Module as a High-Performance Semiconductor Package
2. Multi-Layer Ceramics Manufacturing
3. Microelectronic Packaging
4. Thermal Conduction Module: A High-Performance Multilayer Ceramic Package
5. Adherence-fracture energy of a glass-bonded thick-film conductor: effect of firing conditions
Cited by 82 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Integrity Assessment Through Numerical Simulations;Wellbore Integrity;2023
2. Progressive changes in crystallographic textures of biominerals generate functionally graded ceramics;Materials Advances;2022
3. Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices;ACS Applied Nano Materials;2020-12-28
4. Tuning composition and microstructure by doping Ti and C for enhancing mechanical property and wear resistance of Al0.2Co1.5CrFeNi1.5Ti0.5 high entropy alloy matrix composites;Journal of Alloys and Compounds;2020-09
5. Adaptive hard and tough mechanical response in single-crystal B1 VNx ceramics via control of anion vacancies;Acta Materialia;2020-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3