MiR-221-3p targets HIPK2 to promote diabetic wound healing-Reference-Cited by-同舟云学术

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MiR-221-3p targets HIPK2 to promote diabetic wound healing

Published:2022-03 Issue: Volume:140 Page:104306
ISSN:0026-2862
Container-title:Microvascular Research
language:en
Short-container-title:Microvascular Research

Author:

Yu Qiqi,Liu Lei,Zhang Xin,Chang Hongfeng,Ma Shaobo,Xie Zhenhui,Tang Songtao,Ju Xinmin,Zhu Huaqing,Shen Bing,Zhang Qiu

Funder

Anhui Medical University

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Cell Biology,Cardiology and Cardiovascular Medicine,Biochemistry

Reference28 articles.

1. Diabetes, endothelial dysfunction, and vascular repair: what should a diabetologist keep his eye on?;Altabas;Int. J. Endocrinol.,2015

2. Therapeutic advances of miRNAs: a preclinical and clinical update;Chakraborty;J. Adv. Res.,2021

3. HIPK2 suppresses tumor growth and progression of hepatocellular carcinoma through promoting the degradation of HIF-1 α;Chen;Oncogene,2020

4. Understanding the multifaceted mechanisms of diabetic wound healing and therapeutic application of stem cells conditioned medium in the healing process;Fui;J. Tissue Eng. Regen. M,2019

5. Phosphorylation of TCF proteins by homeodomain-interacting protein kinase 2;Hikasa;J. Biol. Chem.,2011

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1. Angio-microRNAs in diabetic foot ulcer-: Mechanistic insights and clinical perspectives;Progress in Biophysics and Molecular Biology;2024-10

2. Role of microRNAs in diabetic foot ulcers: Mechanisms and possible interventions;Diabetes Research and Clinical Practice;2024-09

3. USP7-stabilised HIPK2 promotes high glucose-induced endothelial cell dysfunctions to accelerate diabetic foot ulcers;Archives of Physiology and Biochemistry;2024-07-27

4. The Angiogenic Repertoire of Stem Cell Extracellular Vesicles: Demystifying the Molecular Underpinnings for Wound Healing Applications;Stem Cell Reviews and Reports;2024-07-13

5. Exosomes: compositions, biogenesis, and mechanisms in diabetic wound healing;Journal of Nanobiotechnology;2024-07-05

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