Effect of intermetallic compound thickness on anisotropy of Al/Cu honeycomb rods fabricated by hydrostatic extrusion process-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effect of intermetallic compound thickness on anisotropy of Al/Cu honeycomb rods fabricated by hydrostatic extrusion process

Published:2016-02 Issue:2 Volume:26 Page:456-463
ISSN:1003-6326
Container-title:Transactions of Nonferrous Metals Society of China
language:en
Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

LEE Tae-hyuk,SIM Moon-soo,JOO Sin-hyeong,PARK Kyoung-tae,JEONG Ha-guk,LEE Jong-hyeon

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference28 articles.

1. Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material [J];LEE;Transactions of Nonferrous Metals Society of China,2012

2. Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics [J];RHEE;Materials Science and Engineering A,2004

3. Study of the intermetallic growth in copper-clad aluminum wires after thermal aging [J];GUEYDAN;Intermetallics,2014

4. Effects of the inner mould material on the aluminum-316L stainless steel explosive clad pipe [J];GUO;Materials & Design,2013

5. Microstructural evolution of copper clad steel bimetallic wire [J];SASAKI;Materials Science and Engineering A,2011

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication of AlN/Cu composite structure via laser surface metallization assisted direct bonding technology;Journal of Manufacturing Processes;2024-06

2. Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer;Journal of Materials Science: Materials in Electronics;2024-02

3. Inhibition of the formation of aluminum–copper intermetallic compounds in direct-bonded aluminum–copper ceramic substrates by using a silver metallic interlayer;Journal of Materials Science;2023-07-23

4. Fabrication of AlN/Cu composite structure via laser metallization assisted direct bonding technology;2023-06-08

5. Aging effect on high heat dissipation DBA and DBAC substrates for high power electronics;Ceramics International;2022-10

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3