Thin diffusion bonded flat loop heat pipes for electronics: Fabrication, modelling and testing

Author:

Domiciano Kelvin G.,Krambeck Larissa,Flórez Juan Pablo M.,Mantelli Marcia B.H.

Funder

Conselho Nacional de Desenvolvimento Científico e Tecnológico

Publisher

Elsevier BV

Subject

Energy Engineering and Power Technology,Fuel Technology,Nuclear Energy and Engineering,Renewable Energy, Sustainability and the Environment

Reference32 articles.

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2. A review of small heat pipes for electronics;Chen;Appl Therm Eng,2016

3. [3] Samsung. Bringing the Galaxy Note9’s Water Carbon Cooling System to Life n.d. https://news.samsung.com/global/bringing-the-water-carbon-cooling-system-to-life (accessed September 24, 2021).

4. [4] Samsung. A Game-changer: How Samsung Optimized the Galaxy Note9 for Next-level Gaming n.d. https://news.samsung.com/global/a-game-changer-how-samsung-optimized-the-galaxy-note9-for-next-level-gaming (accessed September 24, 2021).

5. An ultra-thin miniature loop heat pipe cooler for mobile electronics;Zhou;Appl Therm Eng,2016

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