Author:
Zhou Guohui,Li Ji,Lv Lucang
Funder
National Natural Science Foundation of China
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference20 articles.
1. http://news.mydrivers.com/1/471/471633.htm.
2. High power electronic component: review;Chen;Recent Patents Eng.,2008
3. Integrated thermal management techniques for high power electronic devices;McGlen;Appl. Therm. Eng.,2004
4. I. Saucius, R. Prasher, J. Chang, H. Erturk, G. Chrysler, C. Chiu, R. Mahajan, Thermal performance and key challenges for future CPU cooling technologies, in: Proceedings of IPACK2005, San Francisco, CA, USA, 2005, ASME Paper No. 73242.
5. Review: loop heat pipes;Maydanik;Appl. Therm. Eng.,2005
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