Numerical simulation of flow structures and temperature distribution in a Printed Circuit Board enclosure model at moderate Reynolds numbers-Reference-Cited by-同舟云学术

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Numerical simulation of flow structures and temperature distribution in a Printed Circuit Board enclosure model at moderate Reynolds numbers

Published:2013-08 Issue: Volume:70 Page:1-9
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Varela Sylvana,Usera Gabriel,Vernet Anton,Ferrè Josep A.

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference16 articles.

1. Use of time resolved PIV for validating LES/DNS of the turbulent flow within a PCB enclosure model;Usera;Flow Turbulent Combust.,2006

2. Convection heat transfer in electronic equipment cooling;Incropera;J. Heat Transfer,1988

3. Parametric study of turbulent three-dimensional heat transfer of arrays of heated blocks encountered in electronic equipment;Asako;Int. J. Heat Mass Transfer,1994

4. Heat transfer regime mao for electronic devices cooling;Fushinobu;Int. J. Heat Mass Transfer,1996

5. Convective heat transfer and pressure drop characteristics of various array configurations to simulate the cooling of electronic modules;Jubran;Int. J. Heat Mass Transfer,1996

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1. Simulation Study of the Temperature Field of a Flexible PCB;2024 9th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE);2024-06-27

2. Design of a System for Experimental Study of the Temperature Field of Electronic Modules;2023 13th International Symposium on Advanced Topics in Electrical Engineering (ATEE);2023-03-23

3. Cooling solutions for an electronic equipment box operating on UAV systems under transient conditions;International Journal of Thermal Sciences;2020-06

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