Fluid flow and heat transfer characteristics of microchannel heat sinks with different groove shapes-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Fluid flow and heat transfer characteristics of microchannel heat sinks with different groove shapes

Published:2021-03 Issue: Volume:161 Page:106721
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Zhu Qifeng,Xia Huixue,Chen Junjie,Zhang Xinmin,Chang Kunpeng,Zhang Hongwei,Wang Hua,Wan Jianfeng,Jin Yangyang

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference68 articles.

1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron. Device Lett.,1981

2. An overview of passive techniques for heat transfer augmentation in microchannel heat sink;Sidik;Int. Commun. Heat Mass Tran.,2017

3. A state-of-the-art overview on the developing trend of heat transfer enhancement by single-phase flow at micro scale;Li;Int. J. Heat Mass Tran.,2019

4. Geometry parameters optimization for a microchannel heat sink with secondary flow channel;Shi;Int. Commun. Heat Mass Tran.,2019

5. On the thermal characteristics of a manifold microchannel heat sink subjected to nanofluid using two-phase flow simulation;Pourfattah;Int. J. Heat Mass Tran.,2019

Cited by 81 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simulation study of flow and heat transfer in wavy microchannel heat sink with manifolds and secondary channels composite;International Journal of Thermal Sciences;2024-12

2. Laser-Constructed Bionic Composite Fog-Collecting Surfaces with Efficient Nucleation Sites and Enhanced Water Transport;Langmuir;2024-09-03

3. Enhancing heat transfer efficiency and entropy generation minimization in Micro-Channel Heat Sinks through pillar spacing and diameter optimization;International Journal of Heat and Fluid Flow;2024-09

4. Thermal analysis of a refrigeration system integrated with a thermoelectric couple and microchannels using TiO2-water nanofluid;International Journal of Heat and Fluid Flow;2024-09

5. Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric;Journal of Electronic Packaging;2024-08-24

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3