1. Analytical and Experimental Research on Assembly Systems for Molded Inter connection Devices (3D-MID);Feldmann;Annals of the CIRP,1994
2. Relevance of Assembly in Global Manufacturing;Feldmann;Annals of the CIRP,1996
3. Integrierte Entwicklung neuer Produktund Produktionstechnologien für räumliche spritzgegossene Schaltungsträger (3D MID);Franke,1995
4. “Computer Integrated Design- and Planning-Systems in Electronic Manufacturing”;Feldmann,1996
5. Patterson, T.: Looking for a Commercially Viable Success or to Chip-On-Flex in Electronic Packaging & Production, January 1997, Seite 49 ff