1. “Räumliche spritzgegossene Schaltungsträger helfen Kosten sparen”.;Feldmann,1993
2. Three-Dimensional Circuit Carriers. Kunststoffe, (4/1993);Feldmann,1993
3. K. Feldmann, Franke, J.1991: Automated assembly of new 3D Molded Interconnection Devices. Proceedings 11. IEEE International Electronics Manufacturing Technology Symposium, San Francisco, CA USA, 16.-18. Sept.
4. Systematische Untersuchungen zum Lotpastenauftrag mittels Dispenstechnologie für unterschiedliche Rastermaße.;Feldmann,1993
5. IPC Molded Printed Board Subcommittee, 1989: IPC-MB-380, Guidelines for Molded Interconnects. Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, Illinois