Simulation of the Soldering Process-Reference-Cited by-同舟云学术

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Simulation of the Soldering Process

Published:1998 Issue:1 Volume:47 Page:27-30
ISSN:0007-8506
Container-title:CIRP Annals
language:en
Short-container-title:CIRP Annals

Author:

Niemeier J.,Seliger G.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference9 articles.

1. Wärme- und Stoffübertragung;Baehr,1996

2. Direct Soldering of Electronic Components on Molded Devices;Feldmann;Annals of the CIRP,1995

3. Partielle Löttechnologie als Ergänzung der Reflowmassenlöttechnik;Hirt,1997

4. Entwicklung einer flexiblen und effektiven Montagetechnik für elektronische Bauqruppen;Menzel,1995

5. Application of Advanced Data Processing Technology for Integrated Inspection in Electronical Assembly;Mengel;Annals of the CIRP,1992

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Industrial Soldering Process Simulator;Applied Sciences;2023-11-21

2. Development of a Duothermal Soldering Process;CIRP Annals;2006

3. On-line control of robotized Gas Metal Arc Welding;CIRP Annals;2001

4. Development of a Closed-Loop Controlled Reflow Soldering Process;CIRP Annals;1999

5. Montagetechnik und Fabrikbetrieb;Zeitschrift für wirtschaftlichen Fabrikbetrieb;1998-10-01

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