Nanometer Measurement of Silicon Wafer Surface Texture Based on Fraunhofer Diffraction Pattern
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference6 articles.
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Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Super resolution optical measurements of nanodefects on Si wafer surface using infrared standing evanescent wave;CIRP Annals;2011
2. High Sensitivity Optical Detection of Oriented Microdefects on Silicon Wafer Surfaces Using Annular Illumination;CIRP Annals;2001
3. Measurements of surface defects on optical components;Measurement Science and Technology;1998-04-01
4. Progress in Assessing Surface and Subsurface Integrity;CIRP Annals;1998
5. In-Process Measurement Method for Detection and Discrimination of Silicon Wafer Surface Defects by Laser Scattered Defect Pattern;CIRP Annals - Manufacturing Technology;1998
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