Investigation of stress singularity fields and stress intensity factors for cracks
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Computer Graphics and Computer-Aided Design,General Engineering,Analysis
Reference39 articles.
1. S. Liu, et al., Bimaterial interfacial crack growth as a function of mode-mixity, J. IEEE Trans. Components, Packaging, Manuf. Technol. Part A (1995) 618–626.
2. A.A.O. Tay, G.L. Tan, T.B. Lim, A criterion for predicting delamination in plastic packages, Proc. 31st IEEE Int. Reliability Physics Symp., March 1993.
3. J. Sauber, L. Lee, S. Hsu, T. Hongsmatip, Fracture properties of molding compound materials for IC plastic packaging, Proc. 44th IEEE Electronic Components Technol. Conf., May 1994, pp. 164–170.
4. M. Amagai, Polyimide fatigue induced chip surface damage in DRAM's lead-on-chip (LOC) packages, Proc. 33rd IEEE Int. Reliability Physics Symp., April 1995, pp. 97–106.
5. R. Yuki, Mechanics of Interface, in: Book of the Baihukan, February 1993, pp. 1–283.
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Finite element analyses of failure of fiber reinforced polymer-concrete interface considering the concrete tension–compression softening effect;Theoretical and Applied Fracture Mechanics;2024-06
2. An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
3. Three-dimensional singularity index at interface corner in prismatic butt joint under arbitrary material combination;International Journal of Solids and Structures;2021-10
4. Experimental and Numerical Investigation Into the Plasma Treatment and Chip Delamination in Semiconductor Packaging;IEEE Transactions on Plasma Science;2020-11
5. Application of artificial neural network optimization for resilient ceramic parts fabricated by direct ink writing;International Journal of Applied Ceramic Technology;2019-09-30
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3