Ultra-rapid and low-temperature soldering of hypereutectic Al-Si alloys by ultrasonic-assisted soldering with In interlayer in air for electronic application-Reference-Cited by-同舟云学术

Ultra-rapid and low-temperature soldering of hypereutectic Al-Si alloys by ultrasonic-assisted soldering with In interlayer in air for electronic application

Published:2022-06 Issue: Volume:5 Page:100115
ISSN:2666-3309
Container-title:Journal of Advanced Joining Processes
language:en
Short-container-title:Journal of Advanced Joining Processes

Author:

Nie Yong,Zhu Lin,Lang Qiang,Wang Qian,Yu Peng,Hu Xiaoqiang

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Engineering (miscellaneous),Chemical Engineering (miscellaneous)

Reference17 articles.

1. Subgrain formation in ultrasonic enhanced friction stir welding of aluminium alloy;Padhy;Mater. Lett.,2016

2. Si particulate-reinforced Zn-Al based composites joints of hypereutectic Al-50Si alloys by ultrasonic-assisted soldering;Wang;Mater. Des.,2016

3. Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering;Liu;J. Alloy. Compd.,2016

4. Rapid ultrasound-induced transient-liquid-phase bonding of Al-50Si alloys with Zn interlayer in air for electrical packaging application;Wang;Ultrason. Sonochem,2017

5. Characterizing the soldering alloy type In–Ag–Ti and the study of direct soldering of SiC ceramics and copper;Kolenak;Metals (Basel),2018

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