1. Sera, M., “Method for encapsulating semiconductor devices,” US Patent 4554126, 1985.
2. Kovac, C.A., “Plastic package fabrication,” Electronic Materials Handbook, Minges, M.L., editor, ASM International, Vol. 1 Packaging, pp. 470–482, 1989.
3. Slepcevic, D., “Encapsulation mold with removable cavity plates,” US Patent 4332537, 1982.
4. Handbook of Plastic Materials and Technology;Rubin,1990
5. Microelectronics Packaging Handbook, Semiconductor Packaging, Part II,1997